马秀玲,李永贞,姚恩东,王武军,解祥生,祁善龙,程 曦,李艳锋,黄国杰,尹向前.不同厚度电解铜箔的组织与性能研究[J].稀有金属材料与工程,2019,48(9):2905~2909.[Ma Xiuling,Li Yongzhen,Yao Endong,Wang Wujun,Xie Xiangsheng,Qi Shanlong,Cheng Xi,Li Yanfeng,Huang Guojie,Yin Xiangqian.Study on Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses[J].Rare Metal Materials and Engineering,2019,48(9):2905~2909.]
不同厚度电解铜箔的组织与性能研究
投稿时间:2018-03-30??修订日期:2018-04-19
中文关键词:??电解铜箔??织构??力学性能??尺寸效应
基金项目:国家重点研发计划项目(项目号2016YFB0301300)
中文摘要:
??????通过调整电沉积时间,控制其它电解工艺参数恒定不变,制备了不同厚度的电解铜箔。利用SEM、XRD、EBSD、万能试验机等研究了不同厚度电解铜箔表面形貌、织构、尺寸效应及断裂机制对其拉伸性能的影响,结果表明,随着电沉积时间的增加,铜箔厚度增加,铜箔表面颗粒增大,晶面取向由{111}、{220}、{311}等织构逐渐演变为为{220}强择优取向。铜箔厚度小于18μm时,极薄铜箔由于尺寸效应,抗拉强度和延伸率随铜箔厚度增加而增加。铜箔厚度大于18μm时,随着铜箔厚度增加,晶粒尺寸变大和晶面取向的高择优程度会降低铜箔抗拉强度。
Study on Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses
英文关键词:Electrolytic copper foil??texture??mechanical properties??size effect
英文摘要:
??????Electrolytic copper foils with different thicknesses were prepared by adjusting the electrodeposition time and controlling the parameters of other electrolytic processes. Using SEM, XRD, EBSD, and Universal testing machine to research the effects of surface morphology, texture, size effect and fracture mechanism on the tensile properties of electrolytic copper foil with different thicknesses. The results show that with the progress of electrodeposition, the grain size of the surface increases, and the orientation of the crystal plane {220} becomes stronger. When the copper foil thickness is less than 18 μm, the tensile strength and elongation of the ultra-thin copper foils increase with the thickness of the copper foil due to the size effect.However, when the thickness of the copper foil is more than 18 μm, as the thickness of the copper foil increases, the grain size becomes larger and the degree of crystal plane orientation becomes higher, which reduces the tensile strength of the copper foil. Key words: Electrolytic copper foil; texture; mechanical properties; size effect
作者单位E-mail
马秀玲?青海电子材料产业发展有限公司?maxiuling@ndgf.net?
李永贞?青海电子材料产业发展有限公司??
姚恩东?青海电子材料产业发展有限公司?yaoendong@ndgf.net?
王武军?青海电子材料产业发展有限公司??
解祥生?青海电子材料产业发展有限公司??
祁善龙?青海电子材料产业发展有限公司??
程 曦?有研工程技术亚洲AG手机|开户有限公司 有色金属材料制备加工国家重点实验室??
李艳锋?有研工程技术亚洲AG手机|开户有限公司 有色金属材料制备加工国家重点实验室??
黄国杰?有研工程技术亚洲AG手机|开户有限公司 有色金属材料制备加工国家重点实验室??
尹向前?有研工程技术亚洲AG手机|开户有限公司 有色金属材料制备加工国家重点实验室??
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