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刘晓波,熊震,方洲,李艳.含孔洞的Al2Cu单轴拉伸的分子动力学模拟[J].稀有金属材料与工程(英文),2019,48(9):2745~2752.[Liu Xiaobo,Xiong Zhen,Fang Zhou and Li Yan.Molecular dynamics simulation of tension of Al2Cu with voids[J].Rare Metal Materials and Engineering,2019,48(9):2745~2752.]
Molecular dynamics simulation of tension of Al2Cu with voids
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Received:April 15, 2018??Revised:August 11, 2019
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Key words:?molecular dynamics simulation??tension??void size??void number??void distribution
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Liu Xiaobo,Xiong Zhen,Fang Zhou and Li Yan??
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Abstract:
??????A molecules dynamic simulation model was established to simulate the tension of Al2Cu with voids under the environment of normal temperature and constant engineering strain rate. The influence of void size, quantity and its distribution on the mechanical properties of Al2Cu was studied by adopting embedded atomic method. The results show that the presence of void causes the appearance of free surface in the model and stress concentration at the inner edge of void, which greatly reduce the tensile strength and deformation ability of the material. In addition, the plastic and tensile strength of Al2Cu decrease obviously with the increase of void size. The stress-strain curves corresponding to different number of void are basically overlapped in the elastic deformation stage and both the plasticity and tensile strength decrease for more voids. According to the change of void distribution, it can be find that the smaller the angle between the direction of the connection of the voids and the direction of the tensile, the stronger the plasticity and tensile strength of Al2Cu